iSABers' May Activities & Exhibition Compilation, Sincerely Invite You to Attend~

Pay tribute to the strivers in the semiconductor industry and wish you a happy May Day!

Semiconductor bonding technology is driving revolutionary advancements in 3D integration and advanced packaging! As an innovation leader in low-temperature bonding and bonding integration, iSABers has joined forces with international authoritative institutions such as the Institute for Microsystems Integration (IMSI) of Japan to co-host the 2025 China International Low-Temperature Bonding and 3D Integration Technology Seminar (LTB-3D 2025). This globally top-tier academic conference will make its debut in China, bringing together numerous international giants and global experts to explore the frontiers of wafer bonding technology and its industrial applications.

iSABers' April Activities & Exhibition Compilation, Sincerely Inviting Your Presence~

On March 26th, iSABers held an offline technological innovation sharing session themed "Pioneering the Future of Bonding, Innovating a New Landscape for the Industry" during the 2025 SEMICON China, which attracted extensive attention from the semiconductor industry. At the sharing session, iSABers fully demonstrated its latest breakthroughs in the field of high-end bonding equipment.

On March 25th, at the SEMICON International Conference on Heterogeneous Integration (Advanced Packaging), Dr. Mu Fengwen, Founder and Chairman of iSABers, delivered a keynote speech titled "Advanced Semiconductor Bonding Integration Technology: Innovation-Driven Application Breakthroughs and Industrial Upgrades". The speech showcased the latest breakthroughs by Chinese semiconductor enterprises in bonding technology to the global industry and deeply elaborated on how bonding technology has become a key force driving leapfrog development in the semiconductor industry.

SEMICON In-Person Advanced Bonding Technology Breakthroughs Symposium

SEMICON CHINA 2025 | iSABers Meets You in Shanghai

On March 11th, iSABers held a grand new product launch event in Hong Kong, where the world’s first independently developed C2W&W2W Dual-Mode Hybrid Bonding Equipment SAB 82CWW Series made its stunning debut! The launch brought together top experts, scholars, and media from the semiconductor industry to witness the birth of this disruptive technology.

Global First, Independently Developed, Coming Soon with a Bang!

iSABers' March Exhibition Compilation, Sincerely Inviting Your Presence~

Recently, the 2025 6th Global Mini/Micro LED Display Technology Week was held in Xiamen, with the theme "MLED Empowering Full Scenarios of Vehicle, Home, and Commerce". Bringing together elites from the entire industry chain, the conference focused on MLED technology iteration and application expansion.