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Events & Exhibitions2025-03-04: News | iSABers' March Exhibition Compilation, Sincerely Inviting Your Presence~

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The 9th IEEE Electronic Device Technology and Manufacturing (EDTM 2025)

01 Exhibition Time

March 9-12, 2025

Booth Number

A07

Exhibition venue

Grand Hall B, 1/F, 12W

Hong Kong Science Park

2025 SEMICON CHINA
International Conference on Heterogeneous Integration (Advanced Packaging)

1.Exhibition Information

Exhibition Time

March 26-28, 2025

Booth Number

N2-2235

Exhibition venue

Shanghai New International Expo Center

2.Speech message

01 Meeting time

March 25, 2025

Meeting venue

Shanghai Pudong Kerry Hotel, Pudong Hall 1

Report topic

Advanced Bonding Integration Technology in Semiconductors: Application Breakthroughs and Industrial Upgrades Driven by Innovation

Presenter

Dr. Mu Fengwen (March 25th 16:10-16:30)

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Bonding Equipment