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SAB8300-半自动
C2C TCB键合设备

SAB8300C2C 是一款半自动倒装键合设备,适用于研发、样品验证和小批量生产。可在惰性气体或氢自由基环境下实现micro-bump和pad之间的高精度对准、高可靠互联。

0.3*0.3mm-100*100mm
样品尺寸
3000N
最大压力
±300nm
键合精度
氢自由基活化
RT-450℃
升温时间≤2s
加热能力
SAB8300-半自动 C2C TCB键合设备
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