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SAB8210CW-全自动
C2W混合键合设备

SAB8210CW是一款全自动C2W混合键合设备,既可以使用有图案芯片进行C2W混合键合,实现Cu-Cu高密度互联;也可以使用无图案的裸芯片进行C2W亲水性键合,形成重组晶圆后,再进行后续的芯片图案化。

8-12寸
兼容晶圆尺寸
0.5*0.5mm
芯片最小尺寸
35μm
芯片最小厚度
可选从下往上
键合方向
±200nm
键合精度
UPH≥400
@±200nm键合精度
单键合头产能
SAB8210CW-全自动 C2W混合键合设备
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